When Apple announced the new iPhone models XS and XS Max the company told us that the camera's wide-angle module featured a larger sensor with 1.4 µm pixels compared to 1.22 µm on last year's iPhone X.

Now a teardown performed by TechInsights has confirmed the new sensor, but has also revealed some additional detail about the wide-angle camera. The sensor is a stacked model provided by Sony on a 7.01 mm x 5.79 mm (40.6 mm2) sized die. This is 7.8 mm2 more than the wide-angle camera sensor on the iPhones X and 8 Plus. The actual active area of the sensor is around 5.6 x 4.2 mm, which is likely to see it classed as a 1/2.5"-type chip.

TechInsights engineers noticed an increased density of Focus Pixels

In addition, the TechInsights engineers noticed an increased density of Focus Pixels. This means more regions of the sensor are available as autofocus points and should, at least in theory, improve autofocus performance in most light conditions and shooting situations. Focus Pixels is an Apple term for masked PDAF pixels which were first introduced in 2014 with the iPhone 6.

TechInsight's teardown is still in progress, so we hope the team can provide some more information and also have a closer look at the camera's 2x tele-module, which on paper looks unchanged from last year, over the coming days.