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Re: ... gets the silicon rod
In reply to grampaeddy,
3 months ago
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grampaeddy wrote:
JamieTux wrote:
grampaeddy wrote:
JamieTux wrote:
and if your failure rate per surface area is the same your proportionally losing a lot more FF sensors...
--
James
http://photos.jamestux.com
http://www.flickr.com/photos/jamestux/
http://blog.jamestux.com
Oh, you must be refering to the Nikon dust/oil debacle, no maybe not. I thought that software reprograming the sensor array (for bad pixels) solved some of that. Well, clean rooms aren't what they used to be. Ever sneeze with a mask on (hopefully you weren't congested), gets you alot of stares ! And by the way, the newer growers have increased in girth, purity and mtbf (run times). With all the demand, plant numbers, relliabilty, and return on investment, its like whispering "plastic" in the Graduate (old movie).
No - I am talking way before that - each silicon disc/wafer that the sensors are cut form have defects and in other micro chip processing that defect rate is related to surface area of the whole disc, not the individual chip- you are talking dirt
--
James
http://photos.jamestux.com
http://www.flickr.com/photos/jamestux/
http://blog.jamestux.com
And as I said before, most dirt is silica !!!!
If your chip or sensor has defects no amount of cleaning will make it operate - I don't understand what this has to do with dirt or Nikon - or the graduate for that matter (I've only read the Charles Webb book, never got around to watching the film)
http://www.cambridgeincolour.com/tutorials/digital-camera-sensor-size.htm (cost of production 2/3 down)
"When full-frame sensors were first introduced, production costs could exceed twenty times the cost of an APS-C sensor. Only about thirty full-frame sensors can be produced on an 8 inches (20 cm) silicon wafer that would fit 112 APS-C sensors, and there is a significant reduction in yield due to the large area for contaminants per component. Additionally, the full frame sensor originally required three separate exposures during the photolithography stage, which requires separate masks and quality control steps. The APS-H size was selected since it was then the largest that could be imaged with a single mask to help control production costs and manage yields.[19] Newer photolithography equipment now allows single-pass exposures for full-frame sensors, although other size-related production constraints remain much the same."
from http://en.wikipedia.org/wiki/Image_sensor_format
and
"yield is comparatively low because the sensor's large area makes it very vulnerable to contaminants—20 evenly distributed defects could theoretically ruin an entire wafer. Additionally, the full-frame sensor requires three separate exposures during the photolithography stage, tripling the number of masks and exposure processes.[7]"
from http://en.wikipedia.org/wiki/Full-frame_digital_SLR
--
James
http://photos.jamestux.com
http://www.flickr.com/photos/jamestux/
http://blog.jamestux.com
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